wire bonder的例句大全

Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.

基于解析模型的方法, 研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律.

The automatic wire bonder is one of the primary equipments in semiconductor back-end production.

自动金丝球焊机是半导体制造后端工序的关键设备之一,图像识别系统是其核心技术.

Analysis of Some Factors Improving Performance of Ultrasonic System in Wire Bonder

提高引线键合机超声系统性能的若干因素的分析

Simulation Analysis and Experimental Study of Wire Bonder Precision Positioning Table

键合机精密工作台仿真分析与实验研究

Software Analysis and Design of the Fully Automatic Gold Wire Bonder

全自动引线键合机系统软件分析与设计

Study on the Vision Detection System of Automatic IC Wire Bonder

全自动晶片焊线机视觉检测系统的研究

Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.

超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

Anti-jamming Design in Force Signal Acqusition System of Ultrasonic Al Wire Bonder

超声波铝线邦定机压力信号采集系统的抗干扰设计

Fundamental Principles and Methods of Ultrasonic Control in Wire Bonder

键合机中超声波的基本控制原理及方法

Although manual gold wire bonder has been self-produced in our country, we realize automatic producing not yet, especially challenges still exist in the high speeding, high precision and stability.

虽然我国已能自行生产手动金丝球焊机，但尚未实现自动化，其中芯片定位和识别的实时性、高精度以及稳定性要求还面临着严峻挑战。

Ultrasonic transfer on horn of wire bonder

超声波在引线键合机变幅杆中的传递规律